Could this be used for the next generation of HBM? | Hacker News

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		The_rationalist on Nov 28, 2020 \| parent \| context \| favorite \| on: TSMC: SoIC Could this be used for the next generation of HBM?

baybal2 on Nov 28, 2020 [–]

Not much. HBM will not gain much from going inside the chip pachage over existing interposer solution.

baybal2 on Nov 28, 2020 | [–]

Though, you may decide foregoing the interposer. This way, money go TSMC instead of interposer maker, which was already likelly been TSMC.

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