HBM is just DRAM stacked directly next to the die. The expensive part is gluing ... | Hacker News

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		selectodude 38 days ago \| parent \| context \| favorite \| on: Our eighth generation TPUs: two chips for the agen... HBM is just DRAM stacked directly next to the die. The expensive part is gluing it on there. The chips themselves are pretty much the same.

akelly 38 days ago [–]

HBM uses about twice as much DRAM silicon per GB due to all the space for interconnect

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